ABSTRACT

As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that con

chapter 1|4 pages

Introduction

chapter 3|30 pages

Conductive Cooling

chapter 4|14 pages

Radiation Cooling

chapter 5|48 pages

Fundamentals of Convection Cooling

chapter 6|10 pages

Combined Modes and Transient Heat Transfer

chapter 7|46 pages

Basics of Vibration and Its Isolation

chapter 8|12 pages

Basics of Shock Management

chapter 9|6 pages

Induced Stresses

chapter 10|32 pages

The Finite Element Methods

chapter 11|18 pages

Mechanical and Thermomechanical Concerns

chapter 12|14 pages

Mechanical Reliability

chapter 13|10 pages

Electrical Reliability

chapter 14|12 pages

Chemically Induced Reliability