ABSTRACT
Since its development in the late 1970s, the Moire Fringe method has become a standard technique for the measurement of the behavior of materials and structures. Edited by one of the co-inventors of the technique, the Handbook of Moire Measurement brings together a series of extended case studies from recognized experts in the field. The emphasis i
TABLE OF CONTENTS
part Chapter 2|1 pages
Strain Measurements at the Limit—the Moiré Microscope
chapter Chapter 2.3|9 pages
Localized thermal strains in electronic interconnections by microscopic moiré interferometry
chapter Chapter 2.5|2 pages
Micromechanical thermal deformation of unidirectional boron/aluminum composite
part Chapter 3|1 pages
Fracture Mechanics
chapter Chapter 3.1.1|5 pages
Assessment of the shape of crack-tip plastic zones as a function of applied load
chapter Chapter 3.1.3|8 pages
Applications of moiré to cellulosic (paper and wood) and concrete materials
chapter Chapter 3.2.2|15 pages
Mixed-mode stress intensity factors in finite, edge-cracked orthotropic plates
chapter Chapter 3.2.3|14 pages
A hybrid experimental/computational approach to the assessment of crack growth criteria in composite laminates
chapter Chapter 3.3.1|7 pages
Experimental and computational assessment of the T* fracture parameter during creep relaxation
part Chapter 4|1 pages
Electronic Packaging
chapter Chapter 4.1|11 pages
Determination of effective coefficients of thermal expansion (CTE) of electronic packaging components
chapter Chapter 4.2|11 pages
Determinations of thermal strains in solder joints: an application in electric packaging
chapter Chapter 4.3|8 pages
Thermomechanical behaviour of two-phase solder column connection under highly accelerated thermal cycle
chapter Chapter 4.4|7 pages
Verification of numerical models used in microelectronics product development
chapter Chapter 4.6|5 pages
Characterization of thermomechanical behaviour of a flip-chip plastic ball grid array package assembly
part Chapter 5|1 pages
Complex Shapes
chapter Chapter 5.2|10 pages
A high-precision calibration of electrical resistance strain gauges by moiré interferometry
chapter Chapter 5.3|12 pages
Interlaminar deformation along the cylindrical surface of a hole in laminated composites
chapter Chapter 5.4|14 pages
Interlaminar deformation along the cylindrical surface of a hole in laminated composite tensile specimens
chapter Chapter 5.5|9 pages
Thick laminated composites in compression: free-edge effects on a ply-by-ply basis
part Chapter 6|1 pages
Elastic–Plastic Hole Expansion
chapter Chapter 6.1|11 pages
Elastic–plastic hole expansion: an experimental and theoretical investigation
part Chapter 7|1 pages
Hybrid Mechanics
part Chapter 8|1 pages
Residual Stresses
chapter Chapter 8.1|16 pages
Automated moiré interferometry for residual stress determination in engineering objects
chapter Chapter 8.3|2 pages
Interior strains by a hybrid 3d photoelasticity/moiré interferometry technique
part Chapter 9|1 pages
High Temperature Effects and Thermal Strains
part Chapter 10|1 pages
Micromechanics and Contact Problems
chapter Chapter 10.3|11 pages
Moiré interferometry for measurement of strain near mechanical fasteners in composites
part Chapter 11|1 pages
Out-Of-Plane Deformation, Flatness and Shape Measurement
chapter Chapter 11.2|8 pages
Shadow moiré interferometry with enhanced sensitivity by optical/digital fringe multiplication
chapter Chapter 11.4|11 pages
On-line system for measuring the flatness of large steel plates using projection moiré
part Chapter 12|1 pages
Real Time and Dynamic Moiré